Mechanic XG-80 Solder Paste for BGA reball

Description:

• Top brand Mechanic Solder Paste
• 60g Solder tin paste with IPX3 flux for a183 melting point
• Sn63/Pb37 Alloy
• Suitable for reballing BGA chips or welding in electronic componets

Product Details

The Mechanic XG-80 (now known as XGSP80) High Quality Solder Welding Paste is widely used for mobile phone, computers and other electronic chips for repair and maintenance. Designed with high-grade rich solder, it has no faulty soldering so you can be confident when repairing

• Professional Mechanic XG-80 Solder Paste
• 183 melting point
• 60g tub
• IPX3 flux
• Sn63/Pb37 Alloy

Compatibility

• Brand: Mechanic
• Model: XGSP80 or XG-80
• Alloy: Sn63/Pb37
• Microns:25-45um
• Flux: IPX3
• Weight: 60g
• Melting Point:183
• Suitable for mobile and electronic repair including BGA reballing

Whats In The Box

• 1x Mechanic XG-80 Solder Paste